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MIO-2364A-P2A1 MIO-2364 A101-3 ADL-N Atom x7211E, 6W

  1. Intel® Core™ i3-N305, N-series N97, and x7000E Series x7221E
  2. DDR5-4800 up to 16GB
  3. Dual independent display: LVDS + HDMI
  4. GbE (optional PoE/PD, 802.3at), 4 USB, COM, SMBus/I2C
  5. Expansion: M.2 E-Key, M.2 B-Key
  6. Supports iManager & Software APIs, WISE-DeviceOn
Certifications
CE CE
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Limited availability

€237.47

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Features

Increase computing performance and reduce costs based on the latest Intel processor generation.
Get your offer now.

Intel Atom® processors x7000E Series, Intel® Processor N Series, and Intel® Core™ i3-N305 processors

Design, Customization and Manufacturing Services
Powerful Computing
Powerful Computing
  • 1st 8-Cores i3 CPU @15W
  • 1.4x CPU Perf. (vs Elkhart Lake)
  • *On-board LPDDR5 RAM, 4800MT/s
Excellent for Graphics & AI
Excellent for Graphics & AI
  • 2x GFX Perf. (vs Elkhart Lake)
  • 3x AI Perf.
  • Triple displays up to 4K resolutions
Multi IO Expansion
Multi IO Expansion
  • *Up to 2x 2.5G LAN w/TSN
  • PCIe Gen3, USB3.2 Gen2
  • SATA, *Optional CAN-bus
Safe & Reliable
Safe & Reliable
  • *On-board eMMC
  • TPM2.0, Security Boot
  • Edge AI SDK, DeviceOn
* Features Available On Individual Models *
Performance Comparison
Platform CPU SKU CPU Mark 3D Graphic Mark
Baytrail E3845; 4C 1700 151
Baytrail J1900; 4C 2030 162
Skylake U i3-6100U; 2C 3661 946
Elkhart Lake x6425RE; 4C 2958 468
Elkhart Lake J6412; 4C 1539 297
Alder Lake-N N97; 4C 5456 1163
Alder Lake-N x7211E; 2C 2544 1163
Alder Lake-N i3-N305, 8C 9121 1322
Amston Lake x7211RE; 2C 2644 1054
*Benchmark tests conducted in our lab
Design, Customization and Manufacturing Services

To meet our customer needs, we have a specialized Design & Manufacturing Services (DMS) team, committed to provide professional customization services for industrial-grade computing systems. DMS provides not only collaborative design, flexible manufacturing and global support, but also offers a competitive advantage for every customer. Embracing our core value of altruism, Advantech engages to be your long-term partner, ensuring your prosperity today and into the future.

Time to Prototype
Time to Prototype
Comprehensive Computing Platform
Comprehensive Computing Platform
Early Access Design
Early Access Design
Local Engineering and Global Services
Local Engineering and Global Services
World-Class Quality Assurance
World-Class Quality Assurance
Advantech Embedded Product Solutions
SMARC 2.1.1 Module
SOM-2533
  • Powerful computing
  • Excellent GFX and AI
  • Multi I/O expansion
  • Easy deployment, safe and reliable
COM Express T10 R3.1 Mini
SOM-7533
  • Compact and powerful
  • High speed and low latency I/O
  • Rugged and reliable
  • Easy deployment
COM Express T6 R3.1 Compact
SOM-6833
  • Double the performance with huge cost savings
  • More flexible and low latency I/O
  • Easier deployment and maintenance
  • Reliable and trustworthy
3.5" SBC
MIO-5154
  • Scalable performance
  • Enhanced connectivity and display precision
  • Supporting Windows 11 IoT Enterprise LTSC
  • Integrated board intelligence & boot-guarantee
PICO-ITX 2.5” SBC
MIO-2364
  • Compact and light
  • Offers uncompromised performance
  • Adopts the latest integration and innovation design
  • Supporting Windows 11 IoT Enterprise LTSC
Mini ITX Motherboard
AIMB-219
  • Remarkable performance upgrade
  • Diversified I/O for usage variety
  • Low profile, fanless design
Fanless Edge Intelligent System
ARK-1125C
  • Intel® Atom® Processor x7211E Dual Core SoC
  • Energy Star Certified
  • Various I/O for automation integration
Fanless Edge Intelligent System
ARK-1125H
  • Intel® Processor N-series N200 QC SoC
  • Native AI performance
  • RED certification with AIW-170 (WiFi) and AIW-365 (5G)
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Specifications
Category
Attribute
Value
Display
HDMI
Up to 3840 x 2160 at 30Hz
Display
LCD
LVDS: Dual channel 18/24-bit, up to 1920 x 1080
Memory
Channel/ Socket
Single Channel / 1 Socket
Memory
ECC Support
No
Memory
Max. Capacity
16GB (up to 16GB per SO-DIMM)
Memory
Technology
DDR5 4800 MHz
Processor
BIOS
AMI UEFI 256 Mbit
Processor
Chipset
Integrated in SOC
Processor
Core Number
2
Processor
CPU TDP
6W
Processor
Max Turbo Frequency
3.1 GHz
Environment
Operating Temperature
0 ~ 60℃ (32 ~ 140℉) w/ 0.7m/s airflow
Environment
Storage Temperature
- 40 ~ 85° C (-40 ~185° F)
Power
Connector
ATX 2pin
Power
Power Management
AT, ATX
Power
Power Supply Voltage
12 VDC, ± 10%
Ethernet
Controller
Intel® I226
Ethernet
Speed
10/100/1000/2500 Mbps
Security
TPM
fTPM support by Intel® Platform Trust Technology
Graphics
Max. Frequency
1 GHz
Environment
Relative Humidity
40 °C @ 95%, Non-Condensing
Environment
Vibration Resistance
3.5 Grms
Certification
Electromagnetic
CE, FCC
Expansion
M.2 B-Key
1 x B-Key 2242/3042/3052 with Nano-SIM
Expansion
M.2 E-Key
1 x E-Key 2230
Mechanical
Dimensions
100 x 72 mm
Mechanical
Weight
75g
Internal I/O
Audio
Realtek ALC888s, Line-in/Line-out/MIC
Internal I/O
FAN
1 x 4-Wire Smart Fan, 12V@0.3A
Internal I/O
Front Panel Control
Power LED, HD LED, Reset, Power Switch, Case Open, Buzzer
Internal I/O
GPIO
8-bit general purpose input/output
Internal I/O
I2C
1 (Share with SMBus)
Internal I/O
Inverter
5V/12V, 2A
Internal I/O
SATA
1 x SATA GenIII 6.0 Gbps
Internal I/O
Serial
2 x RS-232/422/485
Internal I/O
SMBus
1
Internal I/O
USB2.0
2
Rear I/O
Ethernet
1
Rear I/O
HDMI
1
Rear I/O
USB 3.2
2
x
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