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Home Peripherals & Modules Embedded Peripherals

Embedded Peripherals

Select embedded peripherals to find a simple solution to add CAN bus or LPT port to your SBC. They can be easily added to any single board computer that has either available Mini-PCIe connecter or USB port.
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Heat spreader for MIO-5251, 3.5" MI/O-Compact Single Board Computers, Heatsink I-Bay Trail-M M-10W 104.38x71.6x16.7-SC
Heatsink for MIO-5251
Heat spreader for MIO-5251, 3.5" MI/O-Compact Single Board Computers, Heatsink I-Bay Trail-M M-10W 104.38x71.6x16.7-SC
  1. Heat spreader for MIO-5251, 3.5" MI/O-Compact Single Board Computers
  2. 16.7mm height
  3. Heatsink I-Bay Trail-M M-10W 104.38x71.6x16.7-SC

€17.33

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Parallel LPT module, 1-Ch, USB I/F
EMIO-100P-MPU01E
Parallel LPT module, 1-Ch, USB I/F
  1. USB to 1x Parallel port module
  2. Full size Mini PCIe & Module type combo
  3. MiniPCIe thru USB & USB Pin Header
  4. Operation temperature 0 to +70 degrees
  5. Support IEEE 1284-compliant ECP
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High-Speed Serial COM module, 1-Ch, USB I/F
EMIO-100S-MPU01E
High-Speed Serial COM module, 1-Ch, USB I/F
  1. USB to 1x High Speed Serial COM port
  2. Full size Mini PCIe & Module type combo
  3. Support High Speed RS232/ RS422/ RS485 port
  4. Widely temperature from -40 ~ 85 degree
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USB to 1-Ch High Speed Serial COM port Module
EMIO-100S-MPU10E
USB to 1-Ch High Speed Serial COM port Module
  1. Full size Mini PCIe & Module type combo
  2. USB to 1 port High Speed Serial COM port with 4K V peak Isolation
  3. RS232 up to 1Mbps, RS422/RS485 up to 10Mbps, FIFO buffer is 1K byte transfer/ receive
  4. Widely temperature from -40 ~ 85 degree
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CIRCUIT BOARD, MI/O module, 4 COM, isolation, powered COM, 2USB
MIOE-110F-00A1E
CIRCUIT BOARD, MI/O module, 4 COM, isolation, powered COM, 2USB
  1. 4 COM support with ±15kV air gap ESD protection: COM1: RS-232/422/485 (Isolation , RS-485 auto flow control), COM2: RS-232/422/485 (Wake on Ring, RS-485 auto flow control, supply 12V/5V power selected by jumper), COM3/4: RS-232 (Wake on Ring)
  2. Support 2 x USB2.0 by internal box wafer connector
  3. Optional rear I/O connector at coastline or internal connector
  4. Mainly compatible with MIO-ultra SBC from mechanical point of view
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